A Compact Ferroelectric 2T-(n+1)C Cell to Implement AND-OR Logic in Memory

Yi Xiao, Yixin Xu, Shan Deng, Zijian Zhao, Sumitha George, Kai Ni, N. Vijaykrishnan
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Abstract

With the proliferation of data-intensive applications, various logic-in-memory (LIM)/ in-memory computing (IMC) solutions are emerging. These solutions aim to mitigate the von Neumann bottleneck caused by frequent data transfer between computational units and memory arrays. Ferroelectric devices such as ferroelectric random access memory (FeRAM), ferroelectric FET (FeFET) and ferroelectric tunnel junction (FTJ) etc., are promising nonvolatile memory (NVM) candidates for the LIM application due to their lower write power compared to competing NVM technologies. In this work, we propose a compact ferroelectric 2T-(n+1) C LIM cell to implement ANDOR logic based on the concept of quasi-nondestructive readout (QNRO) FeRAM. In comparison with 1T-1C FeRAM and 1T FeFET, our structure has both distinguished write and read characteristics. The n-bit AND-OR logic accomplished by our design has $2\mathrm{n}\times$ performance improvement and $5.1\times$ integration density gain against the conventional CMOS logic. Additionally, the area efficiency of our design can be further enhanced by 3D integration. We then verify the correctness of a 3-bit AND-OR logic gate by conducting circuit simulation and device experiments. The simulation results demonstrate a $\sim 70$ ON/OFF ratio with the ON/OFF current window of $\gt866\mathrm{nA}$, and for the experimental results the $\mathrm{ON}/\mathrm{OFF}$ ratio is 3.8 with the current window of $\gt68\mu\mathrm{A}$.
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在存储器中实现与或逻辑的紧凑铁电2T-(n+1)C单元
随着数据密集型应用程序的激增,各种内存中逻辑(LIM)/内存中计算(IMC)解决方案正在出现。这些解决方案旨在缓解由计算单元和存储阵列之间频繁数据传输引起的冯诺依曼瓶颈。铁电器件,如铁电随机存取存储器(FeRAM)、铁电场效应晶体管(FeFET)和铁电隧道结(FTJ)等,由于与竞争的非易失性存储器技术相比,它们的写入功率更低,因此是非易失性存储器(NVM)在LIM应用中很有前途。在这项工作中,我们提出了一个紧凑的铁电2T-(n+1) C LIM单元来实现基于准无损读出(QNRO) FeRAM概念的ANDOR逻辑。与1T- 1c FeRAM和1T ffet相比,我们的结构具有不同的写入和读取特性。与传统CMOS逻辑相比,本设计实现的n位与或逻辑具有$2\mathrm{n}\times$性能改进和$5.1\times$集成密度增益。此外,我们设计的面积效率可以通过3D集成进一步提高。然后,我们通过电路仿真和器件实验验证了3位与或逻辑门的正确性。仿真结果表明,在开/关电流窗为$\gt866\mathrm{nA}$时,开关比为$\sim 70$;实验结果表明,在电流窗为$\gt68\mu\mathrm{A}$时,开关比为$\mathrm{ON}/\mathrm{OFF}$ 3.8。
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