Analysis of Signal Integrity in Coupled MWCNT and Comparison with Copper Interconnects

Abstract

In this paper, the crosstalks induced effects are explored in mutually coupled multi-walled carbon nanotubes (MWCNTs) interconnect lines driven by CMOS gates. The crosstalk delays and the peak voltages on the victim line for functional and dynamic crosstalk are investigated. The analyzes has been done for multiwalled carbon nanotubes and copper on-chip interconnects for 22nm technology node. The results show that exploiting the MWCNT interconnects instead of Cu leads to 61.35% shorter functional crosstalk delay, 12.80% lower functional crosstalk voltage and 59.14% lower dynamic in-phase crosstalk delay and 67.38% lower dynamic out-phase crosstalk delay. For different load capacitances utilizing the MWCNT interconnects instead of Cu leads to 62.79% shorter functional crosstalk delay, 63.54% lower dynamic in-phase crosstalk delay and 68.24% lower dynamic out-phase crosstalk delay. The simulation results show that the MWCNT is significantly highly efficient than conventional copper (Cu) on-chip interconnects. It is observed the results shows that the MWCNT are more fit for very large-scale integration system as compared to the Cu.