Contacting of buried InP-based layers by epitaxial overgrowth over patterned tungsten features

L. Wernersson, L. Jarlskog, A. Lofgren, N. Nilsson, L. Samuelson, W. Seifert, M. Suhara
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Abstract

Features of tungsten have been embedded in InP, with the aim of forming contacts to buried InP-based layers. The conditions for overgrowing W are investigated for various orientations using a ring-structure. The highest lateral growth rate is observed for angles of 30/spl deg/ and 60/spl deg/ from the [110]-direction and wires oriented in these directions may be completely overgrown without the formation of voids above the metal. A specific contact resistance of 4 10/sup -5/ 1/2 cm/sup 2/ has been measured between buried contacts and the n-type InP. Finally, we have studied the dependence of the intrinsic metal resistance on the overgrowth process. The data show that the metal resistance is reduced and values of about 30 1/2 /Sq for 30-nm-thick features are obtained.
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通过外延过度生长在图案钨特征上的埋藏inp基层的接触
钨的特征被嵌入到InP中,目的是与埋藏的InP基层形成接触。利用环状结构研究了不同取向下W的过生长条件。在与[110]方向形成30/spl度和60/spl度的角度时,观察到最高的横向生长速率,并且在这些方向上取向的导线可能完全过度生长而不会在金属上方形成空隙。埋设触点与n型InP之间的比接触电阻为4 10/sup -5/ 1/ 2cm /sup 2/。最后,我们研究了金属固有电阻与过生长过程的关系。数据表明,金属电阻降低,30nm厚特征的电阻值约为30 1/2 /Sq。
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