{"title":"Detailed package failure analysis on short failures after high temperature storage","authors":"Z. Oh, F. Foo, W. Qiu","doi":"10.1109/IPFA.2014.6898174","DOIUrl":null,"url":null,"abstract":"This paper describes the failure analysis approach in search of the root cause behind a series of short failures after high-temperature storage (HTS) test at 150°C. Findings revealed that UBM consumption by tin and the eventual disintegration allowed solder diffusion into the die circuitries resulting in the massive short failures.","PeriodicalId":409316,"journal":{"name":"Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"27 2","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-09-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2014.6898174","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
This paper describes the failure analysis approach in search of the root cause behind a series of short failures after high-temperature storage (HTS) test at 150°C. Findings revealed that UBM consumption by tin and the eventual disintegration allowed solder diffusion into the die circuitries resulting in the massive short failures.
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