High-speed III-V devices for millimeter-wave receiver applications (Invited)

Tsuyoshi Takahashi, Masaru Sato, K. Makiyama, Y. Nakasha, N. Hara, T. Iwai
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引用次数: 2

Abstract

We developed high-speed III-V devices for millimeter-wave receiver applications as InP-based high electron mobility transistors (HEMTs) that had a cavity structure and zero-bias GaAsSb-based heterojunction backward diodes. A high cutoff frequency (fT) of 517 GHz and minimum noise figure (NFmin) of 0.71 dB at 94 GHz were achieved for the InP-based HEMTs, even after the passivation process, by adopting the cavity structure. Since GaAsSb-based diodes that are based on p+-GaAsSb/i-InAlAs/n-InGaAs are mostly lattice-matched to InP, they can be easily integrated with InP-based low-noise amplifiers (LNAs). They indicated a sensitivity of 20,400 V/W at 94 GHz. By integrating the backward diodes with LNAs, highly sensitive receiver MMICs can be fabricated.
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用于毫米波接收机的高速III-V器件(邀请)
我们开发了用于毫米波接收器的高速III-V器件,作为具有腔结构和零偏置gaassb基异质结后向二极管的基于inp的高电子迁移率晶体管(hemt)。通过采用腔体结构,即使经过钝化处理,基于inp的hemt在94 GHz时也能获得517 GHz的高截止频率(fT)和0.71 dB的最小噪声系数(NFmin)。由于基于p+-GaAsSb/i-InAlAs/n-InGaAs的gaassb二极管大多与InP晶格匹配,因此它们可以很容易地与基于InP的低噪声放大器(LNAs)集成。他们指出,94 GHz时的灵敏度为20,400 V/W。通过将后向二极管与LNAs集成,可以制造出高灵敏度的接收器mmic。
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