{"title":"Single chip wireless systems using SOI","authors":"R. Reedy, J. Cable, D. Kelly","doi":"10.1109/SOI.1999.819833","DOIUrl":null,"url":null,"abstract":"In this paper, we have demonstrated the product performance of critical elements of an integrated RFIC. Key requirements and advantages of SOI have been correlated. A highly integrated SOI RFIC with over 100 passive components was shown to have performance suitable for CDMA handsets. We have also shown that SOI can deliver advantageous products.","PeriodicalId":117832,"journal":{"name":"1999 IEEE International SOI Conference. Proceedings (Cat. No.99CH36345)","volume":"41 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"14","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1999 IEEE International SOI Conference. Proceedings (Cat. No.99CH36345)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SOI.1999.819833","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 14
Abstract
In this paper, we have demonstrated the product performance of critical elements of an integrated RFIC. Key requirements and advantages of SOI have been correlated. A highly integrated SOI RFIC with over 100 passive components was shown to have performance suitable for CDMA handsets. We have also shown that SOI can deliver advantageous products.