{"title":"Physical assembly for analog compilation of high voltage ICs","authors":"E. Berkcan, M. d'Abreu","doi":"10.1109/CICC.1988.20865","DOIUrl":null,"url":null,"abstract":"A description is given of the aspects of mixed analog and digital physical assembly relevant to analog silicon compilation. The approach addresses system-level analog design automation through silicon compilation; currently this consists of the synthesis of analog and predesigned digital blocks. The compilation is based on successive decompositions of high-level specifications and physical assembly requirements into those of lower level subblocks and devices. The driving applications are high-voltage application-specific integrated circuits (ASICs). Details of analog and system level physical assembly to satisfy a set of mixed analog, digital, and high-voltage requirements are presented together with the results from an implementation of the compiler.<<ETX>>","PeriodicalId":313270,"journal":{"name":"Proceedings of the IEEE 1988 Custom Integrated Circuits Conference","volume":"2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1988-05-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"22","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the IEEE 1988 Custom Integrated Circuits Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CICC.1988.20865","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 22
Abstract
A description is given of the aspects of mixed analog and digital physical assembly relevant to analog silicon compilation. The approach addresses system-level analog design automation through silicon compilation; currently this consists of the synthesis of analog and predesigned digital blocks. The compilation is based on successive decompositions of high-level specifications and physical assembly requirements into those of lower level subblocks and devices. The driving applications are high-voltage application-specific integrated circuits (ASICs). Details of analog and system level physical assembly to satisfy a set of mixed analog, digital, and high-voltage requirements are presented together with the results from an implementation of the compiler.<>
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