G. Bellomonte, B. Atawa, A. Serghei, N. Michel, Nicolas Delpucch, M. Oualli, Q. Levesque, J. Jacquet, S. Piotrowicz, Emilie Molina, Hermann Sticglaucr, B. Lambert, C. Brylinski, S. L. Delage
{"title":"Polymer Coatings for Better Robustness of GaN-based RF Circuits against Corrosion in SiP","authors":"G. Bellomonte, B. Atawa, A. Serghei, N. Michel, Nicolas Delpucch, M. Oualli, Q. Levesque, J. Jacquet, S. Piotrowicz, Emilie Molina, Hermann Sticglaucr, B. Lambert, C. Brylinski, S. L. Delage","doi":"10.1109/ASDAM55965.2022.9966796","DOIUrl":null,"url":null,"abstract":"In this paper we investigate different polymer coatings to improve robustness in Systems in Packages (SiP) devices for high performance and energy efficient RF-and mm-wave power amplifiers. Cheaper and denser integration of GaN and Si technologies is required. We studied final polymer protection coatings on the semiconductor chip that delay the corrosion phenomenon. Our first results show that BCB seems to be the most efficient protective solution, but there are other materials that could be considered, either for lower dielectric constant or for outstanding electric field handling capability.","PeriodicalId":148302,"journal":{"name":"2022 14th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM)","volume":"46 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 14th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASDAM55965.2022.9966796","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
In this paper we investigate different polymer coatings to improve robustness in Systems in Packages (SiP) devices for high performance and energy efficient RF-and mm-wave power amplifiers. Cheaper and denser integration of GaN and Si technologies is required. We studied final polymer protection coatings on the semiconductor chip that delay the corrosion phenomenon. Our first results show that BCB seems to be the most efficient protective solution, but there are other materials that could be considered, either for lower dielectric constant or for outstanding electric field handling capability.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
