Anisotropic strain evaluation induced in group IV materials using liquid-immersion Raman spectroscopy

A. Ogura, K. Takeuchi
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Abstract

We evaluated anisotropic biaxial strain induced in silicon channel region of metal-oxide-semiconductor field effect transistor (MOSFET) as well as novel channel or source/drain materials such as silicon germanium (SiGe) and germanium tin (GeSn) using liquid-immersion Raman spectroscopy. Uniaxial stress in Si channel region predicted by the simulation was well reproduced by Raman measurement. For the evaluation of SiGe and GeSn, the phonon deformation potentials (PDPs) were derived for the first time, because they are indispensable to obtain the biaxial strain. The PDPs of SiGe indicate clear Ge concentration dependence, which is decreasing with Ge concentration, while the PDPs of GeSn with less than 3.2% Sn concentration exhibit almost constant. Using the derived PDPs, we obtained the anisotropic biaxial strains introduced in the finite patterned SiGe precisely.
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用液浸拉曼光谱对IV类材料进行各向异性应变评价
利用液体浸没拉曼光谱研究了金属氧化物半导体场效应晶体管(MOSFET)的硅沟道区以及新型沟道或源漏材料(如硅锗(SiGe)和锗锡(GeSn))中诱导的各向异性双轴应变。通过拉曼测量可以很好地再现模拟预测的硅通道区域的单轴应力。为了评估SiGe和GeSn,首次推导了声子变形势(pdp),因为它们是获得双轴应变不可或缺的。SiGe的pdp具有明显的Ge浓度依赖性,随Ge浓度的增加而减小,而Sn浓度低于3.2%的GeSn的pdp基本保持不变。利用导出的pdp,我们精确地得到了有限图纹SiGe中引入的各向异性双轴应变。
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From millisecond to nanosecond annealing: Challenges and new approach Anisotropic strain evaluation induced in group IV materials using liquid-immersion Raman spectroscopy Challenges of 2-D (3-D) device doping process and doping profiling metrology Ion implantation technology in SiC for high-voltage/high-temperature devices MIS or MS? Source/drain contact scheme evaluation for 7nm Si CMOS technology and beyond
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