Minimum parasitic resistance for ultra-thin SOI MOSFET with high-permittivity gate insulator performed by lateral contact structure

H. Shimada, T. Ohmi
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Abstract

Since the interconnect capacitance almost maintains the same level even with shrinking device dimension, high current drive of a transistor is required for ultra-high speed operation. Although the ultra-thin SOI MOSFET is a promising candidate for ultra-small devices, its enormous parasitic resistance is a significant problem. The reduction of the parasitic resistance is a key issue in achieving high-performance ultra-thin SOI devices. In this study, a lateral contact structure, unique to SOI devices, with ultra-low contact resistance, is proposed for realizing ultimate low parasitic resistance.
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采用侧触点结构实现高介电常数栅极绝缘体的超薄SOI MOSFET的最小寄生电阻
由于即使器件尺寸缩小,互连电容也几乎保持同一水平,因此超高速运行需要晶体管的大电流驱动。虽然超薄SOI MOSFET是超小型器件的有前途的候选者,但其巨大的寄生电阻是一个重大问题。降低寄生电阻是实现高性能超薄SOI器件的关键问题。本研究提出了SOI器件特有的超低接触电阻横向接触结构,实现了极低的寄生电阻。
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Analytical threshold voltage model for short channel n/sup +/-p/sup +/ double-gate SOI MOSFETs Front and back gate interface-trap generation due to hot carrier stress in fully depleted SOI/MOSFETs SOI material characterization using optical second harmonic generation Minimum parasitic resistance for ultra-thin SOI MOSFET with high-permittivity gate insulator performed by lateral contact structure Transient effects in floating body SOI NMOSFETs
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