Warpage and Simulation Analysis of Panel Level FO-WLCSP Using Equivalent CTE

Abstract

In an electronic packaging process, an improper molding process or design will result in excessive warpage of the package structure. When the warpage is too large, the subsequent process will be difficult to perform. The finite element method (FEM) is a common method for evaluating warpage during the molding process. However, in order to fully simulate the behavior of the epoxy resin during the molding process, a large number of experiments and simulations are required to obtain material parameters. Therefore, this study uses the equivalent thermal expansion coefficient method to simplify the simulation process and estimate the actual experimental warpage. And the method is used to build a panel-level package finite element model to estimate the amount of warpage.