Properties of nano-composite SACX0307-(ZnO, TiO2) solders

B. Illés, A. Skwarek, O. Krammer, T. Hurtony, Dániel Straubinger, J. Ratajczak, G. Harsányi, K. Witek
{"title":"Properties of nano-composite SACX0307-(ZnO, TiO2) solders","authors":"B. Illés, A. Skwarek, O. Krammer, T. Hurtony, Dániel Straubinger, J. Ratajczak, G. Harsányi, K. Witek","doi":"10.23919/empc53418.2021.9585015","DOIUrl":null,"url":null,"abstract":"In the present study, SACX0307-ZnO and SACX0307-TiO2 nano-composite solder pastes were fabricated. The ceramic reinforcements were used in 1wt% and with different primary particle sizes between 50-200nm. The soldering properties and microstructure of the solder joints were investigated. The nano-particles were mixed into the solder paste by standard ball milling process. Reflow soldering technology has been applied to prepare solder joints and spreading tests from the different solder alloys. The solder joints were evaluated by shear test, and cross-sections were prepared to investigate the metallographic properties by Scanning Electron Microscopy (SEM). The different ceramic nano-particles had different effects on the solderability of solder alloys. Best results were observed in the case of TiO2 nano-particles with improved wetting and mechanical strength. The microstructural investigations showed considerable grain refinement and the modified grain boundary/interfacial properties, which could cause the increase of the mechanical parameters.","PeriodicalId":348887,"journal":{"name":"2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-09-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/empc53418.2021.9585015","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

In the present study, SACX0307-ZnO and SACX0307-TiO2 nano-composite solder pastes were fabricated. The ceramic reinforcements were used in 1wt% and with different primary particle sizes between 50-200nm. The soldering properties and microstructure of the solder joints were investigated. The nano-particles were mixed into the solder paste by standard ball milling process. Reflow soldering technology has been applied to prepare solder joints and spreading tests from the different solder alloys. The solder joints were evaluated by shear test, and cross-sections were prepared to investigate the metallographic properties by Scanning Electron Microscopy (SEM). The different ceramic nano-particles had different effects on the solderability of solder alloys. Best results were observed in the case of TiO2 nano-particles with improved wetting and mechanical strength. The microstructural investigations showed considerable grain refinement and the modified grain boundary/interfacial properties, which could cause the increase of the mechanical parameters.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
纳米复合SACX0307-(ZnO, TiO2)钎料的性能
本研究制备了SACX0307-ZnO和SACX0307-TiO2纳米复合锡膏。陶瓷增强剂用量为1wt%,初始粒径在50 ~ 200nm之间。研究了焊点的焊接性能和显微组织。采用标准的球磨工艺将纳米颗粒混合到锡膏中。回流焊技术已应用于不同钎料合金的焊点制备和铺焊试验。通过剪切试验对焊点进行了评价,并制备了焊点截面,通过扫描电子显微镜(SEM)研究了焊点的金相性能。不同的纳米陶瓷颗粒对钎料合金的可焊性有不同的影响。TiO2纳米颗粒的润湿性和机械强度均有改善,效果最好。显微组织研究表明,合金的晶粒细化和晶界/界面性能发生了明显的改变,这可能导致力学参数的增加。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Throughput Optimization of a Sintering Die Attach Process Thermal Properties of Laser-induced Graphene Films Photothermally Scribed on Bare Polyimide Substrates Packaging Solution for RF SiP with on-top Integrated Antenna Development of a Quick Test for Conformal Coatings Properties of nano-composite SACX0307-(ZnO, TiO2) solders
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1