{"title":"Case Study on Package Level Defect Localization through Optimized Lock-in Thermography Frequency","authors":"Carlo M. Casabuena, E. J. de La Cruz","doi":"10.1109/IPFA47161.2019.8984886","DOIUrl":null,"url":null,"abstract":"This case study outlines the successful package-level failure site detection by optimizing the Lock-In Thermography (LIT) frequency based on resistance, combined with 3D X-ray for locating the defect and EDX (Energy Dispersive X-ray) for root-cause analysis. By optimizing the lock-in frequency, the exact location of the defect on the package was identified, thus, leading to effective determination of failure mechanism and accurate root cause investigation.","PeriodicalId":169775,"journal":{"name":"2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"76 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA47161.2019.8984886","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
This case study outlines the successful package-level failure site detection by optimizing the Lock-In Thermography (LIT) frequency based on resistance, combined with 3D X-ray for locating the defect and EDX (Energy Dispersive X-ray) for root-cause analysis. By optimizing the lock-in frequency, the exact location of the defect on the package was identified, thus, leading to effective determination of failure mechanism and accurate root cause investigation.
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