A Study on Parameters That Impact the Thermal Fatigue Life of BGA Solder Joints

ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems Pub Date : 2022-10-25 DOI:10.1115/ipack2022-97253

Karthik Arun Deo, R. Kono, Chongyang Cai, Junbo Yang, Yangyang Lai, Seungbae Park

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引用次数: 7

Abstract

Estimation of the thermal fatigue life of solder joints and identification of parameters that enhance the fatigue life are important steps in the development stage of BGA packages. In this study, different parameters of Sn-Ag-Cu 305 BGA (Ball Grid Array) solder balls are investigated to understand their impact on the number of cycles to failure under thermal fatigue life tests. Initially, accelerated thermal cycling fatigue tests on two electronic packages were conducted by three different vendors and it was observed that the results were significantly different. The first part of this study dwells into understanding the influence of parameters such as the solder mask design; SMD and NSMD, the variation in the solder ball geometry, copper pad thickness and diameter and material properties of the PCB on the accelerated thermal cycling performance of the BGA packages. The later part deals with understanding the root cause for the variation in the estimated life of two BGA packages by the three different vendors.

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影响BGA焊点热疲劳寿命的参数研究

焊点热疲劳寿命的估算和提高焊点疲劳寿命参数的确定是BGA封装开发阶段的重要步骤。在本研究中，研究了Sn-Ag-Cu 305 BGA(球栅阵列)钎料球的不同参数对热疲劳寿命试验中失效循环次数的影响。最初，三个不同的供应商对两个电子封装进行了加速热循环疲劳试验，观察到结果有很大不同。本研究的第一部分着重于了解阻焊设计等参数的影响;SMD和NSMD，焊料球几何形状、铜垫厚度和直径以及PCB材料性能的变化对BGA封装的加速热循环性能的影响。后面的部分讨论了三个不同供应商的两个BGA包的估计寿命差异的根本原因。

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ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

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