Electro-Chemical Migration in Aerosol-Jet Printed Electronics Using Temperature-Humidity and Water Droplet Testing Methods

ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems Pub Date : 2022-10-25 DOI:10.1115/ipack2022-92306

Beihan Zhao, Aniket Bharamgonda, E. Jennings, R. G. Utter, M. Osterman, M. Azarian, Siddhartha Das, A. Dasgupta, J. Fleischer, Edwin Quinn, D. Hines

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Abstract

In this study, temperature-humidity-bias (THB) testing and water droplet (WD) testing have been conducted to study electro-chemical migration (ECM) and dendrite formation across features in aerosol jet printed (AJP) conductor patterns. Test specimen design and testing conditions were guided by industrial standards and related research studies. Time-to-failure (TTF) for AJP printed silver patterns is found to be much smaller than that for conventional copper patterns in THB testing, under identical testing conditions. Furthermore, TTF for dendrite growth between neighboring biased conductors at constant temperature and humidity conditions was found to have a non-monotonic dependence on the electric potential gradient. The dendrite density was found to vary significantly with different applied voltage gradients in both THB testing and WD testing. Those observations can help to guide future investigation and life-prediction modeling of AJP printed electronics subjected to combined temperature, humidity, and voltage stresses.

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使用温度-湿度和水滴测试方法的气溶胶-喷射印刷电子中的电化学迁移

在这项研究中，通过温度-湿度偏差(THB)测试和水滴(WD)测试来研究气溶胶喷射印刷(AJP)导体模式中的电化学迁移(ECM)和枝晶形成特征。试件设计和试验条件以行业标准和相关研究为指导。在相同的测试条件下，在THB测试中发现AJP印刷银图案的故障时间(TTF)比传统铜图案的故障时间要小得多。此外，发现在恒温恒湿条件下相邻偏置导体间枝晶生长的TTF与电位梯度具有非单调依赖性。在THB测试和WD测试中，枝晶密度随施加电压梯度的不同而变化显著。这些观察结果可以帮助指导AJP印刷电子产品在温度、湿度和电压综合应力下的未来研究和寿命预测建模。

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ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

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