I. Schulmeyer, L. Lechner, A. Gu, R. Estrada, D. Stewart, L. Stern, S. McVey, B. Goetze, U. Mantz, R. Jammy
{"title":"Advanced metrology and inspection solutions for a 3D world","authors":"I. Schulmeyer, L. Lechner, A. Gu, R. Estrada, D. Stewart, L. Stern, S. McVey, B. Goetze, U. Mantz, R. Jammy","doi":"10.1109/VLSI-TSA.2016.7480508","DOIUrl":null,"url":null,"abstract":"Semiconductor devices and packages have firmly moved in to an era where scaling is driven by 3D architectures. However, most of the metrology and inspection technologies in use today were developed for 2D devices and are inadequate to deal with 3D structures. An additional complication is the need for specific structural and defect information that may be buried deep within a 3D structure. We present concepts and technologies that allow for 3D imaging as well as tomography, enabling engineers to view structural information with unprecedented clarity, detail and speed.","PeriodicalId":441941,"journal":{"name":"2016 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA)","volume":"170 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-04-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VLSI-TSA.2016.7480508","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
Semiconductor devices and packages have firmly moved in to an era where scaling is driven by 3D architectures. However, most of the metrology and inspection technologies in use today were developed for 2D devices and are inadequate to deal with 3D structures. An additional complication is the need for specific structural and defect information that may be buried deep within a 3D structure. We present concepts and technologies that allow for 3D imaging as well as tomography, enabling engineers to view structural information with unprecedented clarity, detail and speed.
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