Hybrid CMOS/BEOL-NEMS technology for ultra-low-power IC applications

2014 IEEE International Electron Devices Meeting Pub Date : 2014-12-01 DOI:10.1109/IEDM.2014.7047130

N. Xu, Jeff Sun, I. Chen, L. Hutin, Yenhao Chen, J. Fujiki, Chuang Qian, T. Liu

引用次数: 46

Abstract

Three-dimensional (3-D) nano-electro-mechanical (NEM) switches (relays) are proposed to reduce the die area and power consumption of digital logic and memory circuits.

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超低功耗集成电路应用的混合CMOS/BEOL-NEMS技术

为了减少数字逻辑与存储电路的芯片面积和功耗，提出了三维纳米机电开关(继电器)。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2014 IEEE International Electron Devices Meeting

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