{"title":"Algorithmic bus and circuit layout for wafer-scale integration and multichip modules","authors":"G. Chapman, R. Hobson","doi":"10.1109/ICWSI.1993.255264","DOIUrl":null,"url":null,"abstract":"In both laser-link-oriented wafer scale integration (WSI) and multichip modules (MCMs), arrays of devices may be ordered in such a way that the actual physical position of devices is extremely important. Traditional graphic-based design systems are not well suited for such applications. Examples are presented illustrating the effectiveness of a C-based design language (CDL) for WSI laser-link bus placement and MCM chip placement and interconnection. A brief description of the CDL platform is included.<<ETX>>","PeriodicalId":377227,"journal":{"name":"1993 Proceedings Fifth Annual IEEE International Conference on Wafer Scale Integration","volume":"49 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-01-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1993 Proceedings Fifth Annual IEEE International Conference on Wafer Scale Integration","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICWSI.1993.255264","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
In both laser-link-oriented wafer scale integration (WSI) and multichip modules (MCMs), arrays of devices may be ordered in such a way that the actual physical position of devices is extremely important. Traditional graphic-based design systems are not well suited for such applications. Examples are presented illustrating the effectiveness of a C-based design language (CDL) for WSI laser-link bus placement and MCM chip placement and interconnection. A brief description of the CDL platform is included.<>
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