Extraction of interface and border traps in beyond-Si devices by accounting for generation and recombination in the semiconductor

G. Sereni, L. Larcher
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引用次数: 1

Abstract

In this work we will apply a novel extraction procedure to characterize interfacial states and border traps in InGaAs and Ge MOSFETs. The extraction technique, which will allow profiling the defect distributions in the (E,z) dielectric bandgap, is based on the simultaneous simulation of C-V and G-V characteristic over a wide frequency range. The impact of minority carrier generation mechanisms taking place in the semiconductor will be deeply investigated, as its impact is essential when the technique is applied to direct low-bandgap semiconductors such as InGaAs and Ge. Results will confirm that the minority carrier generation has to carefully consider to avoid overestimating the extracted defect density.
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通过计算半导体中的生成和重组来提取超硅器件中的界面和边界陷阱
在这项工作中,我们将应用一种新的提取程序来表征InGaAs和Ge mosfet中的界面态和边界陷阱。该提取技术基于在宽频率范围内同时模拟C-V和G-V特性,可以绘制(E,z)介电带隙中的缺陷分布。在半导体中发生的少数载流子产生机制的影响将被深入研究,因为当该技术应用于直接低带隙半导体(如InGaAs和Ge)时,其影响是必不可少的。结果将证实,少数载流子生成必须仔细考虑,以避免高估提取的缺陷密度。
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