Real-Time Automated Socket Inspection using Advanced Computer Vision and Machine Learning : DI: Defect Inspection and Reduction

C. Edwards, Aditya Kumar, Alex Vaske, Nathan McDaniel, Dipali Pradhan, Debashis Panda
{"title":"Real-Time Automated Socket Inspection using Advanced Computer Vision and Machine Learning : DI: Defect Inspection and Reduction","authors":"C. Edwards, Aditya Kumar, Alex Vaske, Nathan McDaniel, Dipali Pradhan, Debashis Panda","doi":"10.1109/asmc54647.2022.9792494","DOIUrl":null,"url":null,"abstract":"Our test tools pick and place units into sockets for electrical testing. Defects or loose debris accumulated inside the test sockets will likely damage each subsequent unit being tested until the issue is detected and the defective socket is repaired or replaced. To resolve this critical issue, we equipped each pick-and-place arm with a new machine vision system designed to fit inside the existing tool. The limited footprint constraints required a highly compact imaging system which resulted in a variety of image artifacts, creating several unique challenges for the inspection system. We developed an inspection algorithm that utilizes a variety of advanced computer vision and machine learning techniques to normalize and match the images, remove artifacts, and detect defects. The flagged socket images can be manually dispositioned by the user and the socket can be sent for repair or cleaning as needed.","PeriodicalId":436890,"journal":{"name":"2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","volume":"251 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-05-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/asmc54647.2022.9792494","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

Our test tools pick and place units into sockets for electrical testing. Defects or loose debris accumulated inside the test sockets will likely damage each subsequent unit being tested until the issue is detected and the defective socket is repaired or replaced. To resolve this critical issue, we equipped each pick-and-place arm with a new machine vision system designed to fit inside the existing tool. The limited footprint constraints required a highly compact imaging system which resulted in a variety of image artifacts, creating several unique challenges for the inspection system. We developed an inspection algorithm that utilizes a variety of advanced computer vision and machine learning techniques to normalize and match the images, remove artifacts, and detect defects. The flagged socket images can be manually dispositioned by the user and the socket can be sent for repair or cleaning as needed.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
使用先进计算机视觉和机器学习的实时自动插座检测:DI:缺陷检测和减少
我们的测试工具挑选和放置单元插座进行电气测试。测试插座内堆积的缺陷或松散碎片可能会损坏每个后续测试单元,直到发现问题并修复或更换有缺陷的插座。为了解决这个关键问题,我们为每个拾取臂配备了一个新的机器视觉系统,以适应现有的工具。由于占地面积有限,需要高度紧凑的成像系统,这导致了各种图像伪影,给检测系统带来了一些独特的挑战。我们开发了一种检测算法,该算法利用各种先进的计算机视觉和机器学习技术来规范化和匹配图像,去除伪影并检测缺陷。标记的套接字图像可以由用户手动定位,并且可以根据需要发送套接字进行修复或清洗。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
On-wafer organic defect review and classification with universal surface enhanced Raman spectroscopy Supply crisis parts commodities management during unplanned FAB shutdown recovery Nuisance Rate Improvement of E-beam Defect Classification Real-Time Automated Socket Inspection using Advanced Computer Vision and Machine Learning : DI: Defect Inspection and Reduction Negative Mode E-Beam Inspection of the Contact Layer
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1