Negative Mode E-Beam Inspection of the Contact Layer

O. Patterson, MD Golam Faruk, Datong Zhang, Guanchen He, B. Sheumaker
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引用次数: 1

Abstract

Contact CMP is one of the most popular layers for application of e-beam inspection. Using voltage contrast, contact opens and shorts may uniquely be detected. Generally positive surface charging (positive mode) is used, but negative surface charging (negative mode) provides a number of noteworthy advantages, including throughput, which are highlighted in this paper. Usually, adjustment of the landing energy or electric field is used to shift a wafer image into negative mode. This paper introduces and demonstrates a new control knob, beam density.
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接触层负模电子束检测
接触式CMP是电子束检测应用最广泛的层之一。使用电压对比,可以唯一地检测到触点断开和短路。通常使用正表面充电(正模式),但负表面充电(负模式)提供了许多值得注意的优点,包括吞吐量,这在本文中得到了强调。通常,通过调整着陆能量或电场来将晶圆图像转换为负模式。本文介绍并演示了一种新的控制旋钮——光束密度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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