{"title":"Direct bonding for wafer level 3D integration","authors":"L. Di Cioccio, I. Radu, P. Gueguen, M. Sadaka","doi":"10.1109/ICICDT.2010.5510276","DOIUrl":null,"url":null,"abstract":"3D integration is a promising and fast growing field that addresses the convergence of Moore's Law and more than Moore. 3D integration offers higher performance, higher density, higher functionality, smaller form factor, and potential cost reduction. With this emerging field, new and improved technologies will be necessary to meet the associated manufacturing challenges. This paper describes some 3D building blocks describing oxide to oxide and metal to metal bonding with alignment","PeriodicalId":187361,"journal":{"name":"2010 IEEE International Conference on Integrated Circuit Design and Technology","volume":"15 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-06-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"12","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 IEEE International Conference on Integrated Circuit Design and Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICICDT.2010.5510276","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 12
Abstract
3D integration is a promising and fast growing field that addresses the convergence of Moore's Law and more than Moore. 3D integration offers higher performance, higher density, higher functionality, smaller form factor, and potential cost reduction. With this emerging field, new and improved technologies will be necessary to meet the associated manufacturing challenges. This paper describes some 3D building blocks describing oxide to oxide and metal to metal bonding with alignment
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