{"title":"Advanced CMOS Integration Technologies for Future Mobile Applications","authors":"C. Claeys, E. Simoen","doi":"10.1109/SBMicro.2019.8919478","DOIUrl":null,"url":null,"abstract":"Future mobile communication systems and 5G base stations are relying on the availability of a variety of high-speed high-performing semiconductor technologies. Not only advanced CMOS technologies will form the cornerstone but also innovative heterogeneous technologies manufactured on a Si platform will be needed for future System-on-Chip applications. III-nitrides will play an important role in the RF and power parts. While increased system functionality and density can be achieved by 3D integration based on Through Silicon Vias, a strong focus is nowadays going to the monolithic or 3D sequential integration on a Si substrate. Several of these different technologies are reviewed and discussed.","PeriodicalId":403446,"journal":{"name":"2019 34th Symposium on Microelectronics Technology and Devices (SBMicro)","volume":"117 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 34th Symposium on Microelectronics Technology and Devices (SBMicro)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SBMicro.2019.8919478","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
Future mobile communication systems and 5G base stations are relying on the availability of a variety of high-speed high-performing semiconductor technologies. Not only advanced CMOS technologies will form the cornerstone but also innovative heterogeneous technologies manufactured on a Si platform will be needed for future System-on-Chip applications. III-nitrides will play an important role in the RF and power parts. While increased system functionality and density can be achieved by 3D integration based on Through Silicon Vias, a strong focus is nowadays going to the monolithic or 3D sequential integration on a Si substrate. Several of these different technologies are reviewed and discussed.