Ruonan Wang, Robin Lou, K. Cheng, Yeung Yeung, Lydia Leung, Jyh-Rong Lin, T. Chung
{"title":"A low-cost high-density substrate technology for wireless-related applications","authors":"Ruonan Wang, Robin Lou, K. Cheng, Yeung Yeung, Lydia Leung, Jyh-Rong Lin, T. Chung","doi":"10.1109/ECTC.2010.5490780","DOIUrl":null,"url":null,"abstract":"A thin-film on modified ceramic (TFoMC) based substrate technology for achieving high-accuracy and high-uniformity design has been developed and implemented. The integrated passive devices (IPDs), including capacitors, inductors, band-pass filters and Baluns, were realized based on the proposed TFoMC technology. The IPD characterization results were close to the HFSS simulation, and demonstrated good in-substrate uniformity at the same time. The thermal shock and unbiased autoclave measurements were also carried out to evaluate the reliability of the technology. After 1000-cycle thermal shock and 96-hour autoclave storage, the IPDs exhibited no performance degradation, indicating the excellent substrate reliability and making it a promising technology for the wireless-related applications.","PeriodicalId":370741,"journal":{"name":"2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)","volume":"60 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2010.5490780","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
A thin-film on modified ceramic (TFoMC) based substrate technology for achieving high-accuracy and high-uniformity design has been developed and implemented. The integrated passive devices (IPDs), including capacitors, inductors, band-pass filters and Baluns, were realized based on the proposed TFoMC technology. The IPD characterization results were close to the HFSS simulation, and demonstrated good in-substrate uniformity at the same time. The thermal shock and unbiased autoclave measurements were also carried out to evaluate the reliability of the technology. After 1000-cycle thermal shock and 96-hour autoclave storage, the IPDs exhibited no performance degradation, indicating the excellent substrate reliability and making it a promising technology for the wireless-related applications.
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