Idss failure investigated by SIMS profiling and TCAD simulation

Lei Zhu, M. Bai, X. P. Wang, Y. H. Huang, K. Ong, A. Sumarlina, W. Park, Z. Mo, Peck Y. Zheng, S. P. Zhao, J. Lam
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Abstract

A Power MOSFET Idss failure case was studied by SIMS profiling that showed a deeper junction depth between the body/source. TCAD simulation was used to understand the mechanism of the failure.
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通过SIMS分析和TCAD仿真对Idss失效进行了研究
通过SIMS分析研究了功率MOSFET的Idss故障案例,该案例显示了体/源之间更深的结深。采用TCAD仿真分析了其失效机理。
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