Accurate measurement of high-speed package and interconnect parasitics

D. Carlton, K. Gleason, R. Hopkins, J. Jones, K. Noonan, E. Strid
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引用次数: 11

Abstract

Various ideal structures such as small resistors, shorts, and transmission lines are used to verify the calibration of the measurement instrument at the probe tip. Typical measurements of package and interconnect performance are demonstrated, and sample measurements are made, including time domain reflectometry, propagation delay, isolation, and bypassing of power lines. Measurement results are shown.<>
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高速封装和互连寄生的精确测量
利用各种理想结构,如小电阻、短路、传输线等,验证测量仪器在探头尖端的校准。演示了封装和互连性能的典型测量,并进行了采样测量,包括时域反射、传播延迟、隔离和电力线的旁路。测量结果如下所示。
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