T. Ushiki, K. Kotani, T. Funaki, K. Kawai, T. Ohmi
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引用次数: 1
Abstract
As the trend in SOI technology continues to be towards thin-film devices, it is important to take a closer look at the electrically active defects at SOI-BOX interface, which could strongly affect the performance and reliability of SOI devices (Cristoloveanu, 1995). Although several studies on the interface trap densities at the SOI-BOX interface of SIMOX wafers have been reported (Nakashima et al, 1998; Yang et al., 1992), comprehensive analysis of these electrically active defects has not yet been fully studied, despite its scientific interest and technological importance. The purpose of this paper is to show for the first time that extraordinary kink effects have been experimentally observed in back-gate transconductance (g/sub m2/) characteristics of fully-depleted (FD) SOI MOS transistors on high-dose SIMOX wafers, and a physical explanation has been found.
随着SOI技术继续向薄膜器件发展,仔细研究SOI- box接口上的电活性缺陷非常重要,这些缺陷可能会严重影响SOI器件的性能和可靠性(Cristoloveanu, 1995)。虽然已经报道了一些关于SIMOX晶圆SOI-BOX界面陷阱密度的研究(Nakashima et al ., 1998;Yang et al., 1992),对这些电活性缺陷的全面分析尚未得到充分研究,尽管它具有科学意义和技术重要性。本文的目的是首次在实验中观察到高剂量SIMOX晶圆上全耗尽(FD) SOI MOS晶体管的反向跨导(g/sub m2/)特性中的异常扭结效应,并找到了物理解释。