Reliability along the Value Chain – from Chip to Board/System

Abstract

Major trend in Microelectronics is the move towards higher system integration driving increasing compactness and complexity and all at acceptable cost. This paper presents an overview on selected results from the ECSEL JU project iRel40 which has the ultimate goal of improving reliability of electronic components and systems by reducing failure rates along the entire value chain. We first present an aspect for development, where digital twins are applied to develop and design an optimum assembly and packaging. Then we highlight that preassembly, intelligent data handling applied in production, and the importance of material and testing knowhow have impact to improve reliability.