A top-down approach for substrate noise assessment flow in mixed-signal and SOC designs

Hazem Hegazy, E. Hegazi, N. Sabry, H. Ragaie
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Abstract

In this paper, a new substrate noise checking methodology is proposed. We adopt a pragmatic approach in solving the ever complex substrate noise problem. At the full chip level, simulator's capacity is the bottleneck. In order to simplify simulators task, abstraction should be applied on different portions of the problem. Clearly, three portions have been recognized and segregated: Substrate noise generation, propagation and reception. Noise generation is considered to be the biggest contributor especially in larger designs. The larger the number of substrate noise generators, the larger the propagation network that connects to prospect receptors. Accordingly, the first challenge is to separate the injectors from receptors. The second would be the aggregation of all injectors' effects on the receptors' side. In our new top-down approach, an innovative noise generation methodology is introduced with proper propagation macro-model. With both models combined, full chip substrate noise assessment flow has been achieved and verified versus silicon.
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混合信号和SOC设计中基板噪声评估流程的自顶向下方法
本文提出了一种新的衬底噪声检测方法。我们采用实用的方法来解决日益复杂的衬底噪声问题。在全芯片级,模拟器的容量是瓶颈。为了简化模拟器的任务,应该对问题的不同部分进行抽象。显然,已经识别并分离了三个部分:衬底噪声的产生、传播和接收。噪音产生被认为是最大的贡献者,特别是在较大的设计中。衬底噪声发生器的数量越多,连接到潜在受体的传播网络就越大。因此,第一个挑战是将注入剂与受体分离。第二种是所有注射剂对受体的影响的聚合。在自顶向下的方法中,我们引入了一种创新的噪声产生方法,该方法具有合适的传播宏模型。结合这两种模型,实现了全芯片衬底噪声评估流程,并对硅进行了验证。
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