Pouya Namaki, N. Masoumi, M. Nezhad-Ahmadi, S. Safavi-Naeini
{"title":"A Tunable Macro-Modeling Method for Signal Transition in mm-Wave Flip-Chip Technology","authors":"Pouya Namaki, N. Masoumi, M. Nezhad-Ahmadi, S. Safavi-Naeini","doi":"10.1109/SPI52361.2021.9505233","DOIUrl":null,"url":null,"abstract":"In this work, a method for developing a lumped-element circuit macro-modeling of micro/millimeter-wave flip-chip ball interconnects is proposed. The developed macro-model considers the effects of the transmission-line behavior of interconnects as well as the substrate physical characteristics of the chip and the printed circuit board (PCB). Full-wave simulations are used to generate the circuit model for a ground-signal-ground (GSG) bump structure. The derived highly efficient circuit model is verified against a full-wave simulation tool, proving a good agreement. Using the proposed modeling method, the impact of the flip-chip technology package on the electrical performance of high-speed electronic systems can be investigated in the pre-layout design stages that provides room for significant improvements.","PeriodicalId":440368,"journal":{"name":"2021 IEEE 25th Workshop on Signal and Power Integrity (SPI)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 IEEE 25th Workshop on Signal and Power Integrity (SPI)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SPI52361.2021.9505233","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
In this work, a method for developing a lumped-element circuit macro-modeling of micro/millimeter-wave flip-chip ball interconnects is proposed. The developed macro-model considers the effects of the transmission-line behavior of interconnects as well as the substrate physical characteristics of the chip and the printed circuit board (PCB). Full-wave simulations are used to generate the circuit model for a ground-signal-ground (GSG) bump structure. The derived highly efficient circuit model is verified against a full-wave simulation tool, proving a good agreement. Using the proposed modeling method, the impact of the flip-chip technology package on the electrical performance of high-speed electronic systems can be investigated in the pre-layout design stages that provides room for significant improvements.
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