E. Weltevreden, M. Erinc, S. Tesarski, A. Wymyslowski, A. Mavinkurve, A. Giele
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引用次数: 4
Abstract
Delamination of mating interfaces can cause serious reliability problems in different application areas. The causes of delamination are multiple. In the case of leadframe-based chip packages, a critical interface is that between the leadframe and the moulding compound. Delamination can magnify stress levels at the interface and can lead to fatigue of interconnects.
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