Kai Zhang, D. Xiao, Xiaohua Zhang, H. Fan, Z. Gao, M. Yuen
{"title":"Thermal performance of LED packages for solid state lighting with novel cooling solutions","authors":"Kai Zhang, D. Xiao, Xiaohua Zhang, H. Fan, Z. Gao, M. Yuen","doi":"10.1109/ESIME.2011.5765839","DOIUrl":null,"url":null,"abstract":"With the increasing application of high power LEDs in general lighting, more effective cooling solutions should be considered to maintain a better performance and reliability with lower LED junction temperature. In this paper, it is discussed firstly in detail how to effectively take advantage of high thermal performance materials, such as CNTs, to improve the heat conduction in LED packages. Secondly, the air flow velocity field generated by piezoelectric fans is simulated using 3D fluid structure interaction method (FSI) and verified with experimental data. A cooler with a piezoelectric fan inside is designed as a preliminary study on how to apply piezoelectric fans in LED active cooling.","PeriodicalId":115489,"journal":{"name":"2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"39 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"11","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESIME.2011.5765839","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 11
Abstract
With the increasing application of high power LEDs in general lighting, more effective cooling solutions should be considered to maintain a better performance and reliability with lower LED junction temperature. In this paper, it is discussed firstly in detail how to effectively take advantage of high thermal performance materials, such as CNTs, to improve the heat conduction in LED packages. Secondly, the air flow velocity field generated by piezoelectric fans is simulated using 3D fluid structure interaction method (FSI) and verified with experimental data. A cooler with a piezoelectric fan inside is designed as a preliminary study on how to apply piezoelectric fans in LED active cooling.
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