Effect of nitrogen and argon anneals on the leakage current of SIMOX TFSOI devices

H. Shin, T. Wetteroth, S. Wilson, G. Harris, D. Schroder, W. Krull, M. Alles
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引用次数: 3

Abstract

High temperature annealing treatment is a critical step in SIMOX technology. Inert gases such as Ar or N/sub 2/ can be used during this anneal along with a small amount of oxygen. Characterization of TFSOI near-fully-depleted devices built on Ar and N/sub 2/ annealed SIMOX indicate that, in the N/sub 2/ annealed material, nitrogen atoms may become trapped at the SOI/BOX interface and cause excessive sub-threshold leakage in NMOS devices. This paper will discuss the effect of nitrogen on the device characteristics based on electrical and chemical measurements.
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氮气和氩气退火对SIMOX TFSOI器件泄漏电流的影响
高温退火处理是SIMOX技术的关键步骤。在此退火过程中可以使用惰性气体,如Ar或N/sub / 2/,并加入少量氧气。基于Ar和N/sub /退火SIMOX构建的TFSOI近全耗尽器件的表征表明,在N/sub /退火材料中,氮原子可能被困在SOI/BOX界面,导致NMOS器件中过量的亚阈值泄漏。本文将基于电学和化学测量,讨论氮对器件特性的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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