Analysis of polymeric singlemode waveguides for inter-system communication

David Weyers, K. Nieweglowski, L. Lorenz, K. Bock
{"title":"Analysis of polymeric singlemode waveguides for inter-system communication","authors":"David Weyers, K. Nieweglowski, L. Lorenz, K. Bock","doi":"10.23919/empc53418.2021.9584994","DOIUrl":null,"url":null,"abstract":"This paper describes simulation, technology- and process development for the manufacturing of single mode polymeric wave guides by photolithography. Simulations for single mode operation in O- and C-band are carried out. Waveguides are directly patterned with UV-photolithography using Ormocere®-material. Fiber to waveguide coupling and nearfield are characterized.","PeriodicalId":348887,"journal":{"name":"2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)","volume":"58 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-09-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/empc53418.2021.9584994","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

Abstract

This paper describes simulation, technology- and process development for the manufacturing of single mode polymeric wave guides by photolithography. Simulations for single mode operation in O- and C-band are carried out. Waveguides are directly patterned with UV-photolithography using Ormocere®-material. Fiber to waveguide coupling and nearfield are characterized.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
用于系统间通信的聚合物单模波导分析
本文介绍了利用光刻技术制造单模聚合物波导的仿真、技术和工艺开发。对O波段和c波段的单模工作进行了仿真。波导直接图案与紫外线光刻使用ormoere®-材料。光纤波导耦合和近场特性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Throughput Optimization of a Sintering Die Attach Process Thermal Properties of Laser-induced Graphene Films Photothermally Scribed on Bare Polyimide Substrates Packaging Solution for RF SiP with on-top Integrated Antenna Development of a Quick Test for Conformal Coatings Properties of nano-composite SACX0307-(ZnO, TiO2) solders
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1