{"title":"Signal quality test with 3-Dimensional BER opening for non-coherent Ultra Wide-Band (UWB) System-in-Package (SiP)","authors":"C. Yoon, Jiseong Kim, Joungho Kim","doi":"10.1109/EDAPS.2009.5404017","DOIUrl":null,"url":null,"abstract":"This paper introduces a proper quality test of RZ modulated digital signal from non-coherent recovery process in Ultra Wide-Band (UWB) transceiver which is designed by System-in-Package (SiP) technology for wireless mobile application. 3-Dimensional (3D) BER with a marginal window which is multiple sampling points set in eye-diagram is proposed. An area of 3D BER opening at specific BER level provides a noise immunity and susceptibility of whole system in advance.","PeriodicalId":370741,"journal":{"name":"2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDAPS.2009.5404017","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
This paper introduces a proper quality test of RZ modulated digital signal from non-coherent recovery process in Ultra Wide-Band (UWB) transceiver which is designed by System-in-Package (SiP) technology for wireless mobile application. 3-Dimensional (3D) BER with a marginal window which is multiple sampling points set in eye-diagram is proposed. An area of 3D BER opening at specific BER level provides a noise immunity and susceptibility of whole system in advance.
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