A model for enhanced manufacturability of defect tolerant integrated circuits

Z. Koren, I. Koren
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引用次数: 7

Abstract

Many factors contribute the the cost of manufacturing integrated circuits. These include the yield of the design IC, the complexity of its testing, the packaging cost, etc. and they all must be taken into account when designing a defect tolerant integrated circuit. The authors present a mathematical model which includes all major factors contributing to the cost of manufacturing ICs. This model allows the determination of the design which maximizes the expected profit rather than maximizing the yield. Numerical examples illustrating the proposed model are also presented.<>
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提高容缺陷集成电路可制造性的模型
许多因素影响集成电路的制造成本。这些因素包括设计IC的成品率、测试的复杂性、封装成本等,在设计容缺陷集成电路时必须考虑到这些因素。作者提出了一个数学模型,其中包括了影响集成电路制造成本的所有主要因素。该模型允许确定最大化预期利润而不是最大化产量的设计。最后给出了数值算例。
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