The impact of miniaturization and passive component integration in emerging MCM applications

Proceedings 1997 IEEE Multi-Chip Module Conference Pub Date : 1997-02-04 DOI:10.1109/MCMC.1997.569341

Y. Low, R. Frye

引用次数: 19

Abstract

We have designed multichip modules using three alternative technologies for a variety of applications, and have used the results to study the impact of miniaturization and passive component integration on module size, distribution of net length and estimated cost. We have chosen representative applications that include: a digital application with dense interconnections, a mixed-signal application for low-end portable electronics and an analog application requiring a large number of passive components. We compare conventional, laminate-based MCM technology with advanced thin-film-on-laminate technology and silicon-based thin-film MCM technology. We find that the advanced highly miniaturized technologies result not only in higher packaging density and shorter average net length, but in lower estimated module cost as well. Passive component integration can also lower module cost especially in mixed-signal and analog applications.

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小型化和无源元件集成对新兴MCM应用的影响

我们使用三种替代技术为各种应用设计了多芯片模块，并利用结果研究了小型化和无源元件集成对模块尺寸、净长度分布和估计成本的影响。我们选择了具有代表性的应用，包括:具有密集互连的数字应用，用于低端便携式电子设备的混合信号应用以及需要大量无源元件的模拟应用。我们将传统的层压MCM技术与先进的层压上薄膜MCM技术和硅基薄膜MCM技术进行了比较。我们发现，先进的高度小型化技术不仅可以提高封装密度和缩短平均净长度，而且可以降低模块的估计成本。无源元件集成还可以降低模块成本，特别是在混合信号和模拟应用中。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Proceedings 1997 IEEE Multi-Chip Module Conference

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