A 135–170 GHz power amplifier in an advanced sige HBT technology

N. Sarmah, B. Heinemann, U. Pfeiffer
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引用次数: 42

Abstract

Summary form only given. High-power, broadband power amplifiers (PA) operating in the D-band (110-170 GHz) are essential towards implementation of broadband frequency multiplier chains at sub-mmWave frequencies. In this paper we present the design of a 3-stage power amplifier (PA) with 3-dB bandwidth of 35 GHz (135-170 GHz) and implemented in 130 nm SiGe BiCMOS technology. A staggered tuning approach where the peak gain of the individual or group of individual stages are tuned at offset frequencies is used for broadband operation. In the 135-170 GHz, the small signal gain for the PA is 14-17 dB and the saturated output power (Psat) varies from 5-8 dBm and the output referred 1 dB compression point (P1dB) varies from 1-6 dBm over this frequency range. The nominal dc power consumption of this PA is 320 mW with peak PAE of 1.6%. To our best knowledge, this is the highest bandwidth reported for silicon PAs in the D band.
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一种135-170 GHz功率放大器,采用先进的sigehbt技术
只提供摘要形式。工作在d波段(110-170 GHz)的大功率宽带功率放大器(PA)对于实现亚毫米波频率的宽带倍频链至关重要。本文设计了一种3db带宽为35 GHz (135-170 GHz)的三级功率放大器(PA),采用130 nm SiGe BiCMOS技术实现。一种交错调谐方法,其中单个或一组单个级的峰值增益在偏移频率上调谐,用于宽带操作。在135-170 GHz频率范围内,扩音器的小信号增益为14-17 dB,饱和输出功率(Psat)在5-8 dBm之间变化,输出参考1db压缩点(P1dB)在1-6 dBm之间变化。该PA的标称直流功耗为320 mW,峰值PAE为1.6%。据我们所知,这是硅PAs在D波段的最高带宽。
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