Norimasa Fukazawa, Akira Murakawa, Wataru Fujikawa, Jun Shirakami
{"title":"Novel Silver-seed Semi-Additive Process for High Quality Circuit Formation","authors":"Norimasa Fukazawa, Akira Murakawa, Wataru Fujikawa, Jun Shirakami","doi":"10.23919/ICEP.2019.8733443","DOIUrl":null,"url":null,"abstract":"We propose a novel silver-seed semi-additive process (S-SAP) for fabricating electrical circuit of high quality. Thin coated silver layer is used as a conductive seed for plating and is easily removed by selective etching without defects of plated copper wirings. In this system, it was found that the reproducibility of the designed circuit design and the rectangular shape of the wiring are maintained. Therefore, this process has great advantages against the conventional MSAP utilizing copper seed. Here, we will report the results of demonstration of electrical circuit fabrication by silver-seed SAP and discuss the difference between the new process (S-SAP) and conventional Cu-MSAP.","PeriodicalId":213025,"journal":{"name":"2019 International Conference on Electronics Packaging (ICEP)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2019-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 International Conference on Electronics Packaging (ICEP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/ICEP.2019.8733443","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
We propose a novel silver-seed semi-additive process (S-SAP) for fabricating electrical circuit of high quality. Thin coated silver layer is used as a conductive seed for plating and is easily removed by selective etching without defects of plated copper wirings. In this system, it was found that the reproducibility of the designed circuit design and the rectangular shape of the wiring are maintained. Therefore, this process has great advantages against the conventional MSAP utilizing copper seed. Here, we will report the results of demonstration of electrical circuit fabrication by silver-seed SAP and discuss the difference between the new process (S-SAP) and conventional Cu-MSAP.
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