Five forces shaping the silicon world: Advanced sensing and intelligence in IoT and vision

2015 28th IEEE International System-on-Chip Conference (SOCC) Pub Date : 2015-09-01 DOI:10.1109/SOCC.2015.7406942

C. Rowen

引用次数: 0

Abstract

The cumulative improvement in digital silicon density, energy and performance has had an impressive quantitative impact on the world we live in. But new forces, embodied in radical changes in system applications, are rapidly disrupting traditional silicon architectures. In this talk we chart five of the major forces at work in silicon systems, and explore new categories of “things that sense and see”. Along the way, we visit some fundamental shifts taking place in low-energy processor cores, in vision DSPs, and in systems for “deep learning” that now exceed human capabilities.

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塑造硅世界的五大力量:物联网和视觉领域的先进传感和智能

数字硅密度、能量和性能的累积改进对我们生活的世界产生了令人印象深刻的定量影响。但是，体现在系统应用急剧变化中的新力量正在迅速颠覆传统的硅架构。在这次演讲中，我们列出了在硅系统中起作用的五种主要力量，并探索了“能感知和看到的东西”的新类别。在此过程中，我们将看到低能耗处理器核心、视觉dsp和“深度学习”系统中发生的一些根本性变化，这些变化现在已经超出了人类的能力。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2015 28th IEEE International System-on-Chip Conference (SOCC)

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