Identification of stress factors and degradation mechanisms inducing DCR drift in SPADs

Mathieu Sicre, X. Federspiel, D. Roy, Bastien Mamby, C. Coutier, F. Calmon
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引用次数: 2

Abstract

The reliability of Single-Photon Avalanche Diodes (SPADs) is addressed by measurement of Dark Count Rate (DCR) drift as a function of stress time (ΔDCR). The degradation mechanisms are analyzed performing stress-conditions at various temperatures, voltages, and irradiances. Measurement and simulation of current are performed to reinforce the degradation assumptions. Potential degradation locations are investigated by comparison of initial and post ageing DCR at different temperatures together with simulations covering defect position and number in the device. Different variations of manufacturing processes are also studied to further confirm defect positions. All the results have allowed identification of the plausible degradation mechanisms, including Hot-Carrier Degradation (HCD) and charge accumulation at the upper interface occurring in SPADs over a wide range of stress conditions.
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spad诱导DCR漂移的应力因素及降解机制的鉴定
单光子雪崩二极管(SPADs)的可靠性是通过测量暗计数率(DCR)漂移作为应力时间的函数来解决的(ΔDCR)。在不同温度、电压和辐照度的应力条件下,分析了降解机理。通过测量和模拟电流来加强退化假设。通过比较不同温度下初始和后老化DCR,并模拟器件中缺陷的位置和数量,研究了潜在的退化位置。还研究了制造工艺的不同变化,以进一步确定缺陷位置。所有的结果都可以识别出合理的降解机制,包括热载流子降解(HCD)和在广泛的应力条件下发生在spad上界面的电荷积累。
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