Direct-to-Chip Two-Phase Cooling for High Heat Flux Processors

A. Heydari, Yaman M. Manaserh, Ahmad Abubakar, Carol Caceres, Harold Miyamura, A. Ortega, Jeremy Rodriguez
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引用次数: 2

Abstract

Due to the surge in electronics power density, single-phase liquid cooling technologies are emerging to replace legacy air-cooling technologies. However, this surge in electronics power densities is accelerating abruptly, which will cause a single-phase liquid cooling operational lifetime to be much shorter than air cooling. Accordingly, it is essential to look for alternative cooling technologies such as two-phase cooling to replace liquid cooling when its time is up. This work presents comprehensive analyses of two-phase rack-level cooling systems deployment. These analyses can be divided into three main categories which are benchtop testing, rack-level deployment, and choosing a green refrigerant replacement. On the benchtop part of the project, five different cold plates that have different internal geometry are considered. These cold plates are used to build cooling loops with various configurations namely parallel, serial, and hybrid (parallel and serial). An EES code is used to design and evaluate the cold plates and cooling loops based on the existing correlations and modeling techniques. To evaluate this code, a benchtop two-phase experimental setup is built. This setup is designed to test single cold plates and full cooling loops while maintaining system stability. In this setup, high-power-density TTVs with 2.5 kW rated heaters are used to test these cold plates and cooling loops. The work on the benchtop level is just a preparation stage for the rack level deployment, where a custom-built CDU distributes refrigerant to the cooling loops through rack and row manifolds. These cooling loops are placed in multiple racks and attached to TTVs to simulate the thermal load of high-power density servers. In this part of the study, some design perspectives are introduced, and the impact of different operational parameters on CDU performance is explored. The last part of this study discusses the criteria for choosing a green refrigerant to replace existing high GWP ones. Most commonly used refrigerants such as R134a are expected to be phased out very soon due to their high GWP. Therefore, it is necessary to look for an alternative green refrigerant that can be adopted in the system without significantly impacting its performance. Preliminary results showed that R1234yf is the most appropriate replacement for R134a in two-phase rack-level cooling systems.
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高热流处理机直接到芯片的两相冷却
由于电子功率密度的激增,单相液体冷却技术正在取代传统的空气冷却技术。然而,电子功率密度的激增正在突然加速,这将导致单相液冷的工作寿命比空气冷却短得多。因此,必须寻找替代冷却技术,如两相冷却,以取代液体冷却,当它的时间到了。这项工作提出了两相机架级冷却系统部署的全面分析。这些分析可以分为三个主要类别,即台式测试,机架级部署和选择绿色制冷剂替代。在项目的工作台部分,考虑了五种不同的冷板,它们具有不同的内部几何形状。这些冷板用于构建具有各种配置的冷却回路,即并联、串行和混合(并联和串行)。基于现有的关联和建模技术,采用EES规范对冷板和冷却回路进行设计和评价。为了评估该代码,建立了一个台式两相实验装置。该设置旨在测试单个冷板和完整的冷却循环,同时保持系统稳定性。在此设置中,使用具有2.5 kW额定加热器的高功率密度ttv来测试这些冷板和冷却回路。工作台级的工作只是机架级部署的准备阶段,在机架级部署中,定制的CDU通过机架和行形歧管将制冷剂分配到冷却回路中。这些冷却回路被放置在多个机架上,并连接到电视上,以模拟高功率密度服务器的热负载。在这一部分的研究中,介绍了一些设计观点,并探讨了不同的运行参数对CDU性能的影响。本研究的最后一部分讨论了选择绿色制冷剂替代现有高GWP制冷剂的标准。大多数常用的制冷剂,如R134a,由于其高全球升温潜能值,预计将很快被淘汰。因此,有必要寻找一种可替代的绿色制冷剂,该制冷剂可以在系统中采用,而不会对其性能产生重大影响。初步结果表明,在两相机架级冷却系统中,R1234yf是R134a最合适的替代品。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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