Comparative cost analysis for smart-substrate MCM system

Proceedings 1997 IEEE Multi-Chip Module Conference Pub Date : 1997-02-04 DOI:10.1109/MCMC.1997.569361

H. Werkmann, B. Hofflinger

引用次数: 2

Abstract

A cost model for silicon-carrier based MCM systems is presented. The purpose of this cost model is the comparison of test methods for silicon carriers regarding passive substrates and active substrates with integrated test capabilities. Modular models of the different system fabrication steps are developed and combined to a model covering the whole fabrication process. Emphasis is put on the cost modules for substrate fabrication comparing active to passive silicon substrates and on the substrate and system test comparing different test approaches for silicon substrates using test circuitry integrated into an active silicon substrate and the test of passive silicon carriers with conventional test methods.

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智能基板MCM系统的成本比较分析

提出了基于硅载流子的MCM系统的成本模型。本成本模型的目的是比较硅载流子的无源衬底和具有集成测试能力的有源衬底的测试方法。开发了不同系统制造步骤的模块化模型，并将其组合成一个涵盖整个制造过程的模型。重点放在衬底制造的成本模块，比较有源和无源硅衬底，衬底和系统测试，比较硅衬底的不同测试方法，使用集成到有源硅衬底的测试电路和使用传统测试方法测试无源硅载流子。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Proceedings 1997 IEEE Multi-Chip Module Conference

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