{"title":"Simulation of Thermo Mechanical Properties and Reliability of Power IGBT Module","authors":"F. Koval, A. Chvála","doi":"10.1109/ASDAM55965.2022.9966740","DOIUrl":null,"url":null,"abstract":"This paper describes a proposed methodology for simulation of thermomechanical properties and reliability of power IGBT devices and modules. This paper consists of an analysis of the results and design optimization of modern IGBT modules and devices with commercial simulation software support. In practice, these simulations can replace expensive and protracted experimental works in an effort to improve thermomechanical parameters, reliability and operating life time of these components.","PeriodicalId":148302,"journal":{"name":"2022 14th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM)","volume":"283 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 14th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASDAM55965.2022.9966740","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
This paper describes a proposed methodology for simulation of thermomechanical properties and reliability of power IGBT devices and modules. This paper consists of an analysis of the results and design optimization of modern IGBT modules and devices with commercial simulation software support. In practice, these simulations can replace expensive and protracted experimental works in an effort to improve thermomechanical parameters, reliability and operating life time of these components.
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