Design demonstration of band-pass-filter characteristics with integrated passive device on glass interposer

Abstract

We studied the fundamental characteristics of two type passive elements of the integrated passive devices (IPDs) configuration with electromagnetic field analysis and measurement. One is 3D solenoid coil using through glass via (TGV), and another is metal insulator metal (MIM) structured capacitor with inorganic dielectric thin film. Our developed 3D TGV inductor achieved high Q factor by optimizing of solenoid coil design. And our developed MIM capacitor indicates high breakdown voltage by controlling surface roughness condition of metal pad. Furthermore, we demonstrated band pass filter design that passes 2.4GHz to 2.5GHz with the combination of these IPDs. From this evaluation, our developed glass interposer (GiP) with filter function with IPDs achieved very small size, low height and better electrical characteristics compared with conventional LTCC component.