C. Hollerith, B. Kruger, Gurcan Gezerci, S. Pauthner, G. Zimmermann
{"title":"Advanced package circuit modification by μMilling","authors":"C. Hollerith, B. Kruger, Gurcan Gezerci, S. Pauthner, G. Zimmermann","doi":"10.1109/IPFA.2014.6898189","DOIUrl":null,"url":null,"abstract":"As packages get smaller and more complex the necessity grows to do electrical modifications in packages to assist design process. Milling machines with accuracy of sub-μm enable a fast and effective approach to do such a kind of modification. In combination with other techniques, cutting of package connections as well as reconnecting of metal lines is possible.","PeriodicalId":409316,"journal":{"name":"Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"54 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2014.6898189","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
As packages get smaller and more complex the necessity grows to do electrical modifications in packages to assist design process. Milling machines with accuracy of sub-μm enable a fast and effective approach to do such a kind of modification. In combination with other techniques, cutting of package connections as well as reconnecting of metal lines is possible.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
