I. Masada, S. Fujii, S. Imazumi, K. Fujinami, Y. Kanechika, T. Nawata, M. Ueda
{"title":"High thermal conductivity composite resin sheet filled with large diameter aluminum nitride and aggregated boron nitride","authors":"I. Masada, S. Fujii, S. Imazumi, K. Fujinami, Y. Kanechika, T. Nawata, M. Ueda","doi":"10.23919/ICEP.2019.8733583","DOIUrl":null,"url":null,"abstract":"In order to investigate the possibility of high thermal conductivity material, composite resin sheets combining large grain size AlN filler and agglomerated BN filler were prepared and heat conductivity characteristics were evaluated. In combination with BN filler, the superiority of AlN filler to Al2O3 filler was confirmed. We investigated the influence of particle size and blending amount of AlN filler and sheet forming conditions and discussed the problem of high thermal conductivity.","PeriodicalId":213025,"journal":{"name":"2019 International Conference on Electronics Packaging (ICEP)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2019-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 International Conference on Electronics Packaging (ICEP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/ICEP.2019.8733583","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
In order to investigate the possibility of high thermal conductivity material, composite resin sheets combining large grain size AlN filler and agglomerated BN filler were prepared and heat conductivity characteristics were evaluated. In combination with BN filler, the superiority of AlN filler to Al2O3 filler was confirmed. We investigated the influence of particle size and blending amount of AlN filler and sheet forming conditions and discussed the problem of high thermal conductivity.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
