Simulation Study of Thermo-Mechanical Properties of Power Transistor Embedded in PCB

Abstract

Thermo-mechanical simulation study of a power transistor embedded in a printed circuit board (PCB) is presented. The analysis is focused on the optimization of the design to improve the thermal and mechanical reliability performance of the system. Numerical simulations are effectively used in the identification of critical areas in the systems using power transistors embedded in the PCB, and their optimization with respect to lower mechanical strain and better heat transfer, both leading to improved reliability of the final system.