The device architecture dilemma for CMOS technologies: Opportunities & challenges of finFET over planar MOSFET

B. Parvais, A. Mercha, N. Collaert, R. Rooyackers, I. Ferain, M. Jurczak, V. Subramanian, A. De Keersgieter, T. Chiarella, C. Kerner, L. Witters, S. Biesemans, T. Hoffman
{"title":"The device architecture dilemma for CMOS technologies: Opportunities & challenges of finFET over planar MOSFET","authors":"B. Parvais, A. Mercha, N. Collaert, R. Rooyackers, I. Ferain, M. Jurczak, V. Subramanian, A. De Keersgieter, T. Chiarella, C. Kerner, L. Witters, S. Biesemans, T. Hoffman","doi":"10.1109/VTSA.2009.5159300","DOIUrl":null,"url":null,"abstract":"Despite their excellent control of short channel effects, FinFETs suffer from different trade-offs in the mixed-signal domain, with respect to planar devices. For the first time, we report a complete and comprehensive comparative analysis showing that these trade-offs can be alleviated in advanced FinFET technology. As such, higher voltage gain and transconductance than planar MOSFETs are reached at the same time. VT mismatch smaller than 3mV.µm is obtained for narrow (10nm) fins. Reduced speed sensitivity to gate pitch scaling and invertor delay reduced below 10 ps will be demonstrated.","PeriodicalId":309622,"journal":{"name":"2009 International Symposium on VLSI Technology, Systems, and Applications","volume":"36 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-04-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"34","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 International Symposium on VLSI Technology, Systems, and Applications","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VTSA.2009.5159300","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 34

Abstract

Despite their excellent control of short channel effects, FinFETs suffer from different trade-offs in the mixed-signal domain, with respect to planar devices. For the first time, we report a complete and comprehensive comparative analysis showing that these trade-offs can be alleviated in advanced FinFET technology. As such, higher voltage gain and transconductance than planar MOSFETs are reached at the same time. VT mismatch smaller than 3mV.µm is obtained for narrow (10nm) fins. Reduced speed sensitivity to gate pitch scaling and invertor delay reduced below 10 ps will be demonstrated.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
CMOS技术的器件架构困境:finFET相对于平面MOSFET的机遇与挑战
尽管finfet对短通道效应具有出色的控制,但相对于平面器件,它在混合信号域中存在不同的权衡。我们第一次报告了一个完整和全面的比较分析,表明这些权衡可以在先进的FinFET技术中得到缓解。因此,可以同时获得比平面mosfet更高的电压增益和跨导性。VT失配小于3mV。对于窄(10nm)鳍片,取µm。将演示降低对栅极螺距缩放的速度灵敏度和降低到10 ps以下的逆变器延迟。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
High-k/ metal-gate stack work-function tuning by rare-earth capping layers: Interface dipole or bulk charge? Sub-100nm high-K metal gate GeOI pMOSFETs performance: Impact of the Ge channel orientation and of the source injection velocity Sub-32nm CMOS technology enhancement for low power applications Forming-free HfO2 bipolar RRAM device with improved endurance and high speed operation Inversion-type surface channel In0.53]Ga{in0.47As metal-oxide-semiconductor field-effect transistors with metal-gate/high-k dielectric stack and CMOS-compatible PdGe contacts
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1