High signal-to-noise ratio inspection of sub-quarter micrometer oxide CMP defects by using laser scattering inspection tool

K. Kato, A. Ueki, T. Kaga
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引用次数: 1

Abstract

This paper discusses high S/N (signal-to-noise) ratio inspection of sub-quarter micrometer oxide CMP defects, e.g. surface particles, micro-scratches, and pits, using a laser scattering inspection tool. For high S/N inspection, (1) reduction of noise signals from embedded particles, and (2) improvement in sensitivity are the objectives. Optimal selection of the incident-light angle of the laser tool, polarization of the scattered light, and optimized sample structures enable us to achieve the objectives. By applying the new high S/N inspection method, a new insight has been found, i.e. total defect count is in proportion to defect size (threshold value) with the rule of power of -6, which is much larger than the conventional value of -2. Among the killer defects, pits mainly increase very rapidly with the decrease in size. The slope is approximately -7 in the log(count)-log(size) plot.
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利用激光散射检测工具检测亚四分之一微米氧化CMP缺陷的高信噪比
本文讨论了利用激光散射检测工具对亚四分之一微米氧化CMP缺陷(如表面颗粒、微划痕和凹坑)进行高信噪比检测。对于高信噪比检测,(1)降低来自嵌入颗粒的噪声信号,(2)提高灵敏度是目标。优化激光工具的入射光角度、散射光的偏振以及优化样品结构使我们能够实现目标。通过应用新的高信噪比检测方法,发现了一个新的见解,即缺陷总数与缺陷尺寸(阈值)成正比,具有-6的幂规则,比传统的-2值大得多。在这些致命缺陷中,凹坑主要随着尺寸的减小而迅速增加。在log(count)-log(size)图中,斜率约为-7。
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